首頁電子資訊電子零組件及材料

2020 Taiwan Industrial Outlook-Electronics Materials

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字數 4073
頁數 12
出版作者 Jing Han Chen
出版單位 工研院產科國際所
出版日期 2020/09/16
出版類型 產業評析
所屬領域 電子零組件及材料
瀏覽次數 788
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摘要

In the semiconductor materials industry, due to the impact of the US-China trade war and the decline in the memory market, there has been a slight decline in this industry. According to the annual silicon wafer industry analysis report released by Silicon Manufacturers Group (SMG), the total area of silicon wafer production in 2019 is 11,810 (MSI), compared with the combined total area of 12,732 (MSI) in 2018.

IC packaging material industry, the known material is IC substrate. It is mainly divided into ABF and BT substrate. ABF substrate, demand for 5G technology, intelligence, 5G cell site, etc. BT substrate demand memory, set up box (STB), antenna in package (AiP) modules.

內文標題/圖標題/表標題

I. Industry Scope

II. 2019 Review

III. Technology Trends for Emerging Products

IV. The "5+2" Innovation

V. Nations in the New Southbound Policy

VI. Outlook for 2020

Figure 1 Definition & Scope of Electronic Materials Industry

Table 1 Market Growth and Changing Trends for the Global & Taiwanese Electronic Materials Industry in 2019

Table 2 2020 Market Forecasts and Key Observations for Global and Taiwanese Electronic Materials Industries

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