IC package portfolio trends
3D IC market will exceed US$4 billion in 2015
3D Silicon/Glass Interposers
Amkor: 3D interposer supply chain logistics
Roadmaps for 2.5D and 3DIC commercialization
[Application 1] CMOS Image Sensors
iPhone4-BSI(Back Side Illumination) for CIS
3D-WLP MEMS devices forecast per application
Early adoption of 3D MEMS for Handsets
Sensor: e-CUBES Application Demonstrators
Xilinx ’s passive interposers with TSV in FPGA
Xilinx 2.5D FPGA Supply Chain Leading foundry and OSAT partners
Samsung 32GB DDR3 Memory Module for Low Power Server Operations
Elpida Stacked DRAM Module Applications
WW DRAM market share and 3D DRAM activities
Samsung 12.8GB/s Mobile Wide-I/O DRAM with 512 I/Os Using TSV-Based Stacking
Elpida, PTI, and UMC Partner on 3D IC Logic+Memory Integration Solution
Taiwan’s strong position to facilitate Logic+Memory application
Global 3D IC Major Alliance Activities
SEMATECH’s 3D Interconnect Program
Benchmark of iMEC 3D system integration program: Check the gap of Taiwan’s development
Industry Collaboration for TSV Development in IME
12” infrastructure for TSV development in IME
The application of ASET Dream Chips
Ad-STAC: A virtual IDM common platform for boosting Taiwan 3D IC Industry