全球PC市場逐漸好轉，季出貨衰退幅度收窄至-0.8%
Apple與Samsung平板價格偏高、外觀設計差異小， 出貨逐季衰退
品牌手機業者出貨增速趨緩，2Q16較同期衰退1.9%
WSTS預估2016年全球半導體市場衰退2.4% 2017年成長2.0%
台灣半導體產業以IC製造為重心,帶動IC設計與IC封測發展
2016年第2季台灣晶圓代工產業從衰退恢復成長，預估2016年全年成長11.1%
WW Foundry & SATS產能利用率&產值 將於2016Q1落底，Q2起將持續回溫 2016將呈現緩慢回溫態勢
中國第一大封測廠江蘇長電啟動併購 全球封測大廠進入整併潮
Smartphone is still Semiconductor Large Driving Force In 2019 End Product
SiP Breakthrough SoC Limitation Heterogeneous Integration
Small form factor -Board to Package Scale
SiP for Small Form Factor Tech.
Package in Smartphone WLP Become Mainstream
iPhone 6s+ SiP Adoption Almost in RF/Connectivity Module
SiP in Smartphone/Wearable Integration / Miniaturization
OSAT + EMS Emerging SiP Business Model
What about Fan-out Package
WLP Portion is Enlarging!
Fan-out will Extend to Large Pkg. Size
InFO_PoP have both advantages of FC_PoP & 3DIC
Player on Panel Level Fan-out Almost OSAT Company